- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/102 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
Patent holdings for IPC class H01L 27/102
Total number of patents in this class: 441
10-year publication summary
|
43
|
39
|
54
|
40
|
44
|
32
|
19
|
11
|
6
|
2
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Micron Technology, Inc. | 24960 |
55 |
| Zeno Semiconductor, Inc. | 236 |
49 |
| SanDisk 3D LLC | 299 |
48 |
| Samsung Electronics Co., Ltd. | 131630 |
18 |
| TC Lab, Inc. | 31 |
14 |
| Macronix International Co., Ltd. | 2562 |
10 |
| Nantero, Inc. | 233 |
10 |
| Ovonyx Memory Technology, LLC | 502 |
10 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
8 |
| SK Hynix Inc. | 11030 |
8 |
| Murata Manufacturing Co., Ltd. | 22355 |
8 |
| JPMorgan Chase Bank, National Association | 10964 |
7 |
| Kioxia Corporation | 9847 |
7 |
| Texas Instruments Incorporated | 19376 |
6 |
| Renesas Electronics Corporation | 6305 |
6 |
| Sandisk Technologies LLC | 5684 |
6 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
6 |
| International Business Machines Corporation | 60644 |
5 |
| Attopsemi Technology Co., Ltd | 70 |
5 |
| Guobiao Zhang | 54 |
5 |
| Other owners | 150 |